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IS61LV5128AL
512K x 8 HIGH-SPEED CMOS STATIC RAM
ISSI
APRIL 2005
(R)
FEATURES
* High-speed access times: 10, 12 ns * High-performance, low-power CMOS process * Multiple center power and ground pins for greater noise immunity * Easy memory expansion with CE and OE options * CE power-down * Fully static operation: no clock or refresh required * TTL compatible inputs and outputs * Single 3.3V power supply * Packages available: - 36-pin 400-mil SOJ - 36-pin miniBGA - 44-pin TSOP (Type II) * Lead-free available
DESCRIPTION The ISSI IS61LV5128AL is a very high-speed, low power,
524,288-word by 8-bit CMOS static RAM. The IS61LV5128AL is fabricated using ISSI's high-performance CMOS technology. This highly reliable process coupled with innovative circuit design techniques, yields higher performance and low power consumption devices. When CE is HIGH (deselected), the device assumes a standby mode at which the power dissipation can be reduced down to 250 W (typical) with CMOS input levels. The IS61LV5128AL operates from a single 3.3V power supply and all inputs are TTL-compatible. The IS61LV5128AL is available in 36-pin 400-mil SOJ, 36pin mini BGA, and 44-pin TSOP (Type II) packages.
FUNCTIONAL BLOCK DIAGRAM
A0-A18
DECODER
512K X 8 MEMORY ARRAY
VDD GND I/O DATA CIRCUIT
I/O0-I/O7
COLUMN I/O
CE OE WE
Copyright (c) 2005 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.
CONTROL CIRCUIT
Integrated Silicon Solution, Inc. -- www.issi.com -- 1-800-379-4774
Rev. C 04/15/05
1
IS61LV5128AL
PIN CONFIGURATION
36 mini BGA 44-Pin TSOP (Type II)
ISSI
3 4 5 6
(R)
1
2
A B C D E F G H
A0 I/O4 I/O5 GND VDD I/O6 I/O7 A9
A1 A2
NC WE NC
A3 A4 A5
A6 A7
A8 I/O0 I/O1 VDD GND
A18 OE A10 CE A11
A17 A16 A12 A15 A13
I/O2 I/O3 A14
NC NC A0 A1 A2 A3 A4 CE I/O0 I/O1 VDD GND I/O2 I/O3 WE A5 A6 A7 A8 A9 NC NC
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23
NC NC NC A18 A17 A16 A15 OE I/O7 I/O6 GND VDD I/O5 I/O4 A14 A13 A12 A11 A10 NC NC NC
PIN DESCRIPTIONS
A0-A18 CE OE WE I/O0-I/O7 VDD GND NC Address Inputs Chip Enable Input Output Enable Input Write Enable Input Bidirectional Ports Power Ground No Connection
36-Pin SOJ
A0 A1 A2 A3 A4 CE I/O0 I/O1 VDD GND I/O2 I/O3 WE A5 A6 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 NC A18 A17 A16 A15 OE I/O7 I/O6 GND VDD I/O5 I/O4 A14 A13 A12 A11 A10 NC
TRUTH TABLE
Mode WE X H H L CE H L L L OE X H L X I/O Operation High-Z High-Z DOUT DIN VDD Current ISB1, ISB2 ICC ICC ICC Not Selected (Power-down) Output Disabled Read Write
A7 A8 A9
2
Integrated Silicon Solution, Inc. -- www.issi.com -- 1-800-379-4774
Rev. C 04/15/05
IS61LV5128AL
ISSI
Value -0.5 to VDD + 0.5 -65 to +150 1.0 Unit V C W
(R)
ABSOLUTE MAXIMUM RATINGS(1)
Symbol VTERM TSTG PT Parameter Terminal Voltage with Respect to GND Storage Temperature Power Dissipation
Notes: 1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
OPERATING RANGE
VDD Range Commercial Industrial Ambient Temperature 0C to +70C -40C to +85C 10ns 3.3V +10%, -5% 3.3V +10%, -5% 12ns 3.3V +10% 3.3V +10%
CAPACITANCE(1,2)
Symbol CIN CI/O Parameter Input Capacitance Input/Output Capacitance Conditions VIN = 0V VOUT = 0V Max. 6 8 Unit pF pF
Notes: 1. Tested initially and after any design or process changes that may affect these parameters. 2. Test conditions: TA = 25C, f = 1 MHz, VDD = 3.3V.
Integrated Silicon Solution, Inc. -- www.issi.com -- 1-800-379-4774
Rev. C 04/15/05
3
IS61LV5128AL
ISSI
Test Conditions VDD = Min., IOH = -4.0 mA VDD = Min., IOL = 8.0 mA Min. 2.4 -- 2.0 -0.3 GND VIN VDD GND VOUT VDD, Outputs Disabled Com. Ind. Com. Ind. -2 -5 -2 -5 Max. -- 0.4 VDD + 0.3 0.8 2 5 2 5 Unit V V V V A A
(R)
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
Symbol Parameter VOH VOL VIH VIL ILI ILO Output HIGH Voltage Output LOW Voltage Input HIGH Voltage Input LOW Voltage Input Leakage Output Leakage
(1)
Note: 1. VIL = -3.0V for pulse width less than 10 ns.
POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range)
Symbol Parameter ICC ISB VDD Dynamic Operating Supply Current TTL Standby Current (TTL Inputs) TTL Standby Current (TTL Inputs) CMOS Standby Current (CMOS Inputs) Test Conditions VDD = Max., Com. IOUT = 0 mA, f = fMAX Ind. VDD = Max., VIN = VIH or VIL CE VIH, f = fMAX. VDD = Max., VIN = VIH or VIL CE VIH, f = 0 Com. Ind. Com. Ind. -10 Min. Max. -- -- -- -- -- -- -- -- 90 95 40 45 20 25 15 20 -12 Min. Max. -- -- -- -- -- -- -- -- 85 90 35 40 20 25 15 20 Unit mA mA
ISB1
mA
ISB2
VDD = Max., Com. CE VDD - 0.2V, Ind. VIN VDD - 0.2V, or VIN 0.2V, f = 0
mA
Note: 1. At f = fMAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
4
Integrated Silicon Solution, Inc. -- www.issi.com -- 1-800-379-4774
Rev. C 04/15/05
IS61LV5128AL
READ CYCLE SWITCHING CHARACTERISTICS(1) (Over Operating Range)
Symbol Parameter Read Cycle Time Address Access Time Output Hold Time CE Access Time OE Access Time OE to High-Z Output OE to Low-Z Output CE to High-Z Output CE to Low-Z Output Power Up Time Power Down Time -10 Min. Max. 10 -- 2 -- -- -- 0 0 3 0 -- -- 10 -- 10 4 4 -- 4 -- -- 10 -12 Min. Max. 12 -- 2 -- -- -- 0 0 3 0 -- -- 12 -- 12 5 5 -- 6 -- -- 12 Unit ns ns ns ns ns ns ns ns ns ns ns
ISSI
(R)
tRC tAA tOHA tACE tDOE tHZOE(2) tLZOE(2) tHZCE(2 tLZCE(2) tPU tPD
Notes: 1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0V to 3.0V and output loading specified in Figure 1. 2. Tested with the load in Figure 2. Transition is measured 500 mV from steady-state voltage.
AC TEST CONDITIONS
Parameter Input Pulse Level Input Rise and Fall Times Input and Output Timing and Reference Levels Output Load Unit 0V to 3.0V 3 ns 1.5V See Figures 1 and 2
AC TEST LOADS
319 3.3V
3.3V
319
OUTPUT 30 pF Including jig and scope 353
OUTPUT 5 pF Including jig and scope 353
Figure 1
Figure 2 5
Integrated Silicon Solution, Inc. -- www.issi.com -- 1-800-379-4774
Rev. C 04/15/05
IS61LV5128AL
AC WAVEFORMS READ CYCLE NO. 1(1,2) (Address Controlled) (CE = OE = VIL)
t RC
ADDRESS
ISSI
(R)
t AA t OHA
DOUT
PREVIOUS DATA VALID
t OHA
DATA VALID
READ1.eps
READ CYCLE NO. 2(1,3) (CE and OE Controlled)
t RC
ADDRESS
t AA
OE
t OHA
t DOE
CE
t HZOE
t LZOE t ACE t LZCE t HZCE
DATA VALID
CE_RD2.eps
DOUT
HIGH-Z
Notes: 1. WE is HIGH for a Read Cycle. 2. The device is continuously selected. OE, CE = VIL. 3. Address is valid prior to or coincident with CE LOW transitions.
6
Integrated Silicon Solution, Inc. -- www.issi.com -- 1-800-379-4774
Rev. C 04/15/05
IS61LV5128AL
ISSI
-10 Min. Max. 10 8 8 0 0 8 10 6 0 -- 2 -- -- -- -- -- -- -- -- -- 5 -- -12 Min. Max. 12 8 8 0 0 8 12 6 0 -- 2 -- -- -- -- -- -- -- -- -- 6 -- Unit ns ns ns ns ns ns ns ns ns ns ns
(R)
WRITE CYCLE SWITCHING CHARACTERISTICS(1,3) (Over Operating Range)
Symbol Parameter Write Cycle Time CE to Write End Address Setup Time to Write End Address Hold from Write End Address Setup Time WE Pulse Width WE Pulse Width (OE = LOW) Data Setup to Write End Data Hold from Write End WE LOW to High-Z Output WE HIGH to Low-Z Output
tWC tSCE tAW tHA tSA tPWE1 tPWE2 tSD tHD tHZWE(2) tLZWE(2)
Notes: 1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0V to 3.0V and output loading specified in Figure 1. 2. Tested with the load in Figure 2. Transition is measured 500 mV from steady-state voltage. Not 100% tested. 3. The internal write time is defined by the overlap of CE LOW and WE LOW. All signals must be in valid states to initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling edge of the signal that terminates the write.
AC WAVEFORMS WRITE CYCLE NO. 1(1,2) (CE Controlled, OE = HIGH or LOW)
t WC
ADDRESS
VALID ADDRESS
t SA
CE
t SCE
t HA
WE
t AW t PWE1 t PWE2 t HZWE t LZWE
HIGH-Z
DOUT
DATA UNDEFINED
t SD
DIN
t HD
DATAIN VALID
CE_WR1.eps
Integrated Silicon Solution, Inc. -- www.issi.com -- 1-800-379-4774
Rev. C 04/15/05
7
IS61LV5128AL
WRITE CYCLE NO. 2(1,2) (WE Controlled: OE is HIGH During Write Cycle)
t WC
ADDRESS
VALID ADDRESS
ISSI
(R)
t HA
OE
CE
LOW
t AW t PWE1
WE
t SA
DOUT
DATA UNDEFINED
t HZWE
HIGH-Z
t LZWE
t SD
DIN
t HD
DATAIN VALID
CE_WR2.eps
Notes: 1. The internal write time is defined by the overlap of CE LOW and WE LOW. All signals must be in valid states to initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling edge of the signal that terminates the Write. 2. I/O will assume the High-Z state if OE > VIH.
WRITE CYCLE NO. 3 (WE Controlled: OE is LOW During Write Cycle)
t WC
ADDRESS
VALID ADDRESS
OE CE
LOW
t HA
LOW
t AW t PWE2
WE
t SA
DOUT
DATA UNDEFINED
t HZWE
HIGH-Z
t LZWE
t SD
DIN
t HD
DATAIN VALID
CE_WR3.eps
8
Integrated Silicon Solution, Inc. -- www.issi.com -- 1-800-379-4774
Rev. C 04/15/05
IS61LV5128AL
ISSI
Package 400-mil Plastic SOJ TSOP (Type II) 400-mil Plastic SOJ TSOP (Type II)
(R)
ORDERING INFORMATION Commercial Range: 0C to +70C
Speed (ns) 10 10 12 12 Order Part No. IS61LV5128AL-10K IS61LV5128AL-10T IS61LV5128AL-12K IS61LV5128AL-12T
Industrial Range: -40C to +85C
Speed (ns) 10 10 10 10 10 10 12 Order Part No. IS61LV5128AL-10KI IS61LV5128AL-10KLI IS61LV5128AL-10TI IS61LV5128AL-10TLI IS61LV5128AL-10BI IS61LV5128AL-10BLI IS61LV5128AL-12TI Package 400-mil Plastic SOJ 400-mil Plastic SOJ, Lead-free TSOP (Type II) TSOP (Type II), Lead-free mini BGA (8mmx10mm) mini BGA (8mmx10mm), Lead-free TSOP (Type II)
Integrated Silicon Solution, Inc. -- www.issi.com -- 1-800-379-4774
Rev. C 04/15/05
9
PACKAGING INFORMATION
Mini Ball Grid Array Package Code: B (36-pin)
Top View 1 2 3 4 56 6
ISSI
Bottom View
b (36x)
(R)
5
4
3
2
1
A B C D D E F G H D1
e
A B C D E F G H
e E E1
Notes: 1. Controlling dimensions are in millimeters.
A2 SEATING PLANE A1 A
mBGA - 6mm x 8mm
MILLIMETERS Sym.
N0. Leads A A1 A2 D D1 E E1 e b -- 0.24 0.60
mBGA - 8mm x 10mm
INCHES Min. Typ. Max.
36
MILLIMETER Sym.
N0. Leads
INCHES Min. Typ. Max.
36
Min. Typ. Max.
36 -- -- -- 5.25BSC 5.90 6.00 3.75BSC 0.75BSC 0.30 0.35 0.40 6.10 1.20 0.30 -- 8.10
Min. Typ. Max.
36 -- 0.24 0.60 -- -- -- 5.25BSC 7.90 8.00 8.10 3.75BSC 0.75BSC 0.30 0.35 0.40 1.20 0.30 --
-- 0.009 0.024
-- -- --
0.047 0.012 --
A A1 A2 D D1 E E1 e b
-- 0.009 0.024
-- -- --
0.047 0.012 --
7.90 8.00
0.311 0.315 0.319 0.207BSC 0.232 0.236 0.240 0.148BSC 0.030BSC 0.012 0.014 0.016
9.90 10.00 10.10
0.390 0.394 0.398 .207BSC 0.311 0.315 0.319 0.148BSC 0.030BSC 0.012 0.014 0.016
Copyright (c) 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. -- www.issi.com -- 1-800-379-4774
Rev. E 01/15/03
PACKAGING INFORMATION
400-mil Plastic SOJ Package Code: K
ISSI
Notes: 1. Controlling dimension: millimeters. 2. BSC = Basic lead spacing between centers. 3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package. 4. Reference document: JEDEC MS-027.
(R)
N
N/2+1
E1
E
1
N/2
D A
SEATING PLANE
b
C A2
e
B
A1
E2
Symbol No. Leads A A1 A2 B b C D E E1 E2 e
Millimeters Inches Min Max Min Max (N) 28 3.25 3.75 0.128 0.148 0.64 -- 0.025 -- 2.08 -- 0.082 -- 0.38 0.51 0.015 0.020 0.66 0.81 0.026 0.032 0.18 0.33 0.007 0.013 18.29 18.54 0.720 0.730 11.05 11.30 0.435 0.445 10.03 10.29 0.395 0.405 9.40 BSC 0.370 BSC 1.27 BSC 0.050 BSC
Millimeters Min Max 32 3.25 3.75 0.64 -- 2.08 -- 0.38 0.51 0.66 0.81 0.18 0.33 20.82 21.08 11.05 11.30 10.03 10.29 9.40 BSC 1.27 BSC
Inches Min Max 0.128 0.148 0.025 -- 0.082 -- 0.015 0.020 0.026 0.032 0.007 0.013 0.820 0.830 0.435 0.445 0.395 0.405 0.370 BSC 0.050 BSC
Millimeters Min Max 36 3.25 3.75 0.64 -- 2.08 -- 0.38 0.51 0.66 0.81 0.18 0.33 23.37 23.62 11.05 11.30 10.03 10.29 9.40 BSC 1.27 BSC
Inches Min Max 0.128 0.148 0.025 -- 0.082 -- 0.015 0.020 0.026 0.032 0.007 0.013 0.920 0.930 0.435 0.445 0.395 0.405 0.370 BSC 0.050 BSC
Copyright (c) 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. -- www.issi.com -- 1-800-379-4774
Rev. F 10/29/03
PACKAGING INFORMATION
ISSI
Millimeters Min Max 42 3.25 3.75 0.64 -- 2.08 -- 0.38 0.51 0.66 0.81 0.18 0.33 27.18 27.43 11.05 11.30 10.03 10.29 9.40 BSC 1.27 BSC Inches Min Max 0.128 0.148 0.025 -- 0.082 -- 0.015 0.020 0.026 0.032 0.007 0.013 1.070 1.080 0.435 0.445 0.395 0.405 0.370 BSC 0.050 BSC Millimeters Min Max 44 3.25 3.75 0.64 -- 2.08 -- 0.38 0.51 0.66 0.81 0.18 0.33 28.45 28.70 11.05 11.30 10.03 10.29 9.40 BSC 1.27 BSC 0.128 0.148 0.025 -- 0.082 -- 0.015 0.020 0.026 0.032 0.007 0.013 1.120 1.130 0.435 0.445 0.395 0.405 0.370 BSC 0.050 BSC Inches Min Max
(R)
Millimeters Inches Symbol Min Max Min Max No. Leads (N) 40 A 3.25 3.75 0.128 0.148 A1 0.64 -- 0.025 -- A2 2.08 -- 0.082 -- B 0.38 0.51 0.015 0.020 b 0.66 0.81 0.026 0.032 C 0.18 0.33 0.007 0.013 D 25.91 26.16 1.020 1.030 E 11.05 11.30 0.435 0.445 E1 10.03 10.29 0.395 0.405 E2 9.40 BSC 0.370 BSC e 1.27 BSC 0.050 BSC
Copyright (c) 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.
2
Integrated Silicon Solution, Inc. -- www.issi.com -- 1-800-379-4774
Rev. F 10/29/03
PACKAGING INFORMATION
Plastic TSOP Package Code: T (Type II)
ISSI
Notes: 1. Controlling dimension: millimieters, unless otherwise specified. 2. BSC = Basic lead spacing between centers. 3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package. 4. Formed leads shall be planar with respect to one another within 0.004 inches at the seating plane.
(R)
N
N/2+1
E1
E
1 D
N/2
SEATING PLANE
ZD
A
.
e b L A1 C
Symbol Ref. Std. No. Leads A A1 b C D E1 E e L ZD
Millimeters Min Max
Inches Min Max
Plastic TSOP (T - Type II) Millimeters Inches Min Max Min Max 44 -- 1.20 -- 0.047 0.05 0.15 0.002 0.006 0.30 0.45 0.012 0.018 0.12 0.21 0.005 0.008 18.31 18.52 0.721 0.729 10.03 10.29 0.395 0.405 11.56 11.96 0.455 0.471 0.80 BSC 0.032 BSC 0.41 0.60 0.016 0.024 0.81 REF 0.032 REF 0 5 0 5
Millimeters Min Max 50 -- 1.20 0.05 0.15 0.30 0.45 0.12 0.21 20.82 21.08 10.03 10.29 11.56 11.96 0.80 BSC 0.40 0.60 0.88 REF 0 5
Inches Min Max
(N) 32 -- 1.20 -- 0.047 0.05 0.15 0.002 0.006 0.30 0.52 0.012 0.020 0.12 0.21 0.005 0.008 20.82 21.08 0.820 0.830 10.03 10.29 0.391 0.400 11.56 11.96 0.451 0.466 1.27 BSC 0.050 BSC 0.40 0.60 0.016 0.024 0.95 REF 0.037 REF 0 5 0 5
-- 0.047 0.002 0.006 0.012 0.018 0.005 0.008 0.820 0.830 0.395 0.405 0.455 0.471 0.031 BSC 0.016 0.024 0.035 REF 0 5
Copyright (c) 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. -- www.issi.com -- 1-800-379-4774
Rev. F 06/18/03

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